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三金电子
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微晶玻璃封装外壳
产品中心
产品中心
(背面补)IMG_8771
IMG_8655
IMG_8654
DSCF7678
(背面补)IMG_8776
DSCF7676
DSCF7679
IMG_8653
(背面补)IMG_8771
IMG_8655
IMG_8654
DSCF7678
(背面补)IMG_8776
DSCF7676
DSCF7679
IMG_8653

微晶玻璃封装外壳

所属分类 : 微晶玻璃外壳
更短的加工周期,成本更低,使用金属与刚压玻璃作为主体部件,不再受限于陶瓷结构,有更大的设计变化空间

微晶玻璃封装外壳相较于原有黑陶瓷封装外壳,有更短的加工周期,成本更低,使用金属与刚压玻璃作为主体部件,不再受限于陶瓷结构,有更大的设计变化空间。与多层陶瓷外壳相比更具软性,强度比黑陶瓷外壳高。可使用平行滚焊,金锡熔焊工艺进行密封,可满足更多小批量客户测试使用。

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